Journal Articles
- D. Kim, E. Lee, J. Seo, J. Kim, S. K. Lim, and S. Mukhopadhyay, “An SRAM Compiler for Monolithic-3D Integrated Circuit with Carbon Nanotube Transistors,” accepted for publications in IEEE Journal of Exploratory Solid-State Computational Devices and Circuits (JXCDC).
- J. Kim, V. Chekuri, N. Rahman, M. Dolatsara, H. Torun, M. Swaminathan, S. Mukhopadhyay, and S. K. Lim, “Chiplet/Interposer Co-Design for Power Delivery Network Optimization in Heterogeneous 2.5D ICs”, accepted for publication in IEEE Transactions on Components, Packaging and Manufacturing Technology.
- E. Lee, D. Kim, J. Kim, S. Lim and S. Mukhopadhyay, “A ReRAM Memory Compiler for Monolithic-3D Integrated Circuits in a Carbon Nanotube Process”, accepted for publication at ACM Journal on Emerging Technologies in Computing Systems(JETC).
- A. Chaudhuri, S. Banerjee, H. Park, J. Kim, G. Murali, E. Lee, D. Kim, S. K. Lim, S. Mukhopadhyay, and K. Chakrabarty, “Advances in Design and Test of Monolithic 3D ICs,” IEEE Design Test, 2020, vol. 37, no. 4, August 2020, pp. 92-100.
- J. Kim, G. Murali, H. Park, E. Qin, H. Kwon, V. Chekuri, N. M. Rahman, N. Dasari, A. Singh, M. Lee, H. M. Torun, K. Roy, M. Swaminathan, S. Mukhopadhyay, T. Krishna, and S. K. Lim, “Architecture, Chip, and Package Co-design Flow for Interposer-based 2.5D Chiplet Integration Enabling Heterogeneous IP Reuse,” IEEE Transactions on VLSI Systems (TVLSI), vol. 28, no 11, November 2020, pp. 2424-2437.
- H. Park, J. Kim, V. Chekuri, M. Dolatsara, M. Nabeel, A. Bojesomo, S. Patnaik, O. Sinanoglu, M. Swaminathan, S. Mukhopadhyay, J. Knechtel, and S. Lim “Design Flow for Active Interposer-Based 2.5-D ICs and Study of RISC-V Architecture With Secure NoC,” IEEE Transactions on Component, Packaging, and Manufacturing Technology (TCPMT), vol. 10, no. 12, Dec. 2020, pp. 2047-2060.
- S. Mukhopadhyay, Y. Long, B. Mudassar, C. Nair,B. H. Deprospo, H. M. Torun, M. Kathaperumal, V. Smet, D. Kim, S. Yalamanchili, and M. Swaminathan, “Heterogenous Integration for Artificial Intelligence: Challenges and Opportunities,” IBM Journal of Research and Development (IBM J. R&D), vol. 63 , no. 6 , Nov.-Dec. 2019, pp. 4.1-4.23.
- E. Lee, A. Singh, H. M. Torun, J. Kim, S. K. Lim, M. Swaminathan, and S. Mukhopadhyay, “Automated I/O Library Generation for Interposer-based System-in-Package Integration of Multiple Heterogeneous Dies,” IEEE Transactions on Component, Packaging, and Manufacturing Technology (TCPMT), vol 10, no. 1, Nov. 2019, pp. 111-122.
Conference Articles
- J. Kim, V. Chekuri, N. M. Rahman, M. A. Dolatsara, H. Torun, M. Swaminathan, S. Mukhopadhyay, and S. Lim, “Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration,” IEEE International Conference on Computer Design (ICCD), October 2020.
- J. Kim, H. Park, E. Lee, D. Kim, A. Chaudhuriy, S. Banerjee, M. Nelson, S. Mukhopadhyay, K. Chakrabarty, and S. K. Lim, “RTL-to-GDS Design Tools for Monolithic 3D ICs Built with Carbon Nanotube Transistors and Resistive Memory,” GOMACTECH, March 2020.
- H. Park, K. Chang, B. W. Ku, J. Kim, E. Lee, D. Kim, A. Chaudhuri, S. Banerjee, S. Mukhopadhyay, K. Chakrabarty, and S. K. Lim, “RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs,” Design Automation Conference (DAC), June 2019.
- J. Kim, G. Murali, H. Park, E. Qin, H. Kwon, V. Chekuri, N. Dasari, A. Singh, M. Lee, H. M. Torun, K. Roy, M. Swaminathan, S. Mukhopadhyay, T. Krishna, and S. Kyu Lim, “Architecture, Chip, and Package Co-design Flow for 2.5D Integration of Reusable IP Chiplets”, Design Automation Conference (DAC), June 2019.
- H. M. Torun, H. Yu, Dasari, V. Chekuri, A. Singh, J. Kim, S. K. Lim, S. Mukhopadhyay, and M. Swaminathan, “A Spectral Convolutional Net for Co-Optimization of Integrated Voltage Regulators and Embedded Inductors,” International Conference on Computer Aided Design (ICCAD), November 2019.
- E. Lee, D. Kim, V. Chekuri, Y. Long, and S. Mukhopadhyay, “A ReRAM Memory Compiler with Layout-Precise Performance Evaluation,” IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), October 2018
- M. Lee, A. Singh, H. Torun, J. Kim, S Lim, M. Swaminathan, and S. Mukhopadhyay. “ Automated Generation of All-Digital I/O Library Cells for Multiple Dies in System-in-Package Integration,” GOMACTECH, March 2019.
- H. M. Torun, N. Dasari, A. Singh, M. Lee,J. Kim, H. Park, H. Kwon, E. Qin, T. Krishna, S. K. Lim, S. Mukhopadhyay and M. Swaminathan, “Design Space Exploration of Power Delivery in Heterogeneous Integration,” GOMACTECH, March 2019.
- M. Lee, J. Kim, A. Singh, H. M. Torun, M. Swaminathan, S. Lim, and S. Mukhopadhyay, “On the Design of Energy-Efficient I/O Circuits for Interposer-based 2.5D System-in-Package,” IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018.
- M. Lee, A. Singh, H. M. Torun, J. Kim, S. Lim, M. Swaminathan, and S. Mukhopadhyay, “Automated Generation of All-Digital I/O Library Cells for System-in-Package Integration of Multiple Dies,” IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2018.