Research Area Energy-Efficient Design

Energy-Efficient Design

The GREEN lab seeks to develop techniques to enhance energy-efficiency of integrated circuits. We view energy-efficiency as an integrated problem that connects power delivery, low-power circuit/system design, and thermal management. The solutions are explored at different levels of design hierarchy ranging from low-power algorithms to mixed-signal circuits to innovative applications of emerging devices. We are studying the impact of advanced 2.5D/3D packaging technologies on the energy-efficient system design. The key research vectors under energy-efficient design thrust are: 

  1. Power delivery and voltage regulation. GREEN lab’s research is exploring effective voltage regulation methods for mobile digital processors and ultra-low-power systems with energy harvesting. The objective is to develop circuit techniques to facilitate integration of voltage regulators (VR) in the same chip/package with a System-on-Chip (SoC) and co-design a regulator and the SoC to enhance energy-efficiency and reduce physical size of the system. The research focusses on inductive buck converters for high-performance processors as well as inductive boost/buck converters for energy harvesting. For more details on this topic click here. For recent publications click here.
  2. Low-power circuits and systems: GREEN lab explores an integrated approach to power reduction in digital and mixed-signal systems. The innovative circuit techniques are coupled with innovation in micro-architecture and algorithms to reduce energy dissipation. The driving principle behind our low-power research is to minimize built-in safety margin in the design of integrated circuits and optimally (dynamically) balance the energy dissipation and  quality-of-service of a system under all environments. The group’s research focusses on the cross-layer interactions and co-design between technology, circuit, and algorithms to achieve this goal. For more details on this topic click here. For recent publications click here.
  3. Electro-thermal co-design: Thermal management has always been important in high-performance servers. However, demand for more complex processing in smaller form-factors and stringent user-experience requirements are making thermal management in mobile platforms an emerging challenge. GREEN lab has research explores electro-thermal co-design methods for systems with limited cooling capacity. Our contributions include innovative approaches and hardware demonstrations for (i) post-silicon thermal characterization and management, and (ii) integration of advanced active cooling, such as, thermoelectric  devices and in-package microfluidics for mobile processors.  For more details on this topic click here. For recent publications click here.
  4. Advanced 2.5D/3D Packaging: We are investigating 2.5D/3D integration of heterogeneous systems with varying system characteristics and power profile as a technology enabler for energy-efficient systems. We have developed techniques to address design challenges for 3D integrations. Currently, our research is focussed on understanding architectural implications of 3D/2.5D integration to enable orders of magnitude scaling in energy-efficiency for different applications. For more details on this topic click here. For recent publications click here.