We view energy-efficiency as an integrated problem that connects power delivery, low-power circuit/system design, and thermal management; and modulated by advanced 2.5D/3D packaging technologies. Our holistic approach to energy-efficient design consists of following thrusts:
- Integrated Voltage Regulation. Our objective is to design efficient voltage regulators (VR) integrated in the same chip/package with a System-on-Chip (SoC). The research focusses on (i) high-frequency inductive regulators and digital low-dropout (DLDO) regulators, (ii) self-tuning of inductive and DLDO regulators under variation and aging, and (iii) Inductive boost/buck converters for energy harvesting.
- Low-power circuits and systems: The driving principle behind our low-power research is to minimize built-in safety margin in the design of integrated circuits and optimally (dynamically) balance the energy dissipation and quality-of-service of a system under all environments. Our approaches include (i) zero-margin adaptive digital circuits; (ii) approximate accuracy-aware µ-architecture; (iii) reconfigurable system with volatile/non-volatile memory; (iv) cross-layer energy management in wireless systems
- Electro-thermal co-design for mobile platforms: GREEN lab has research explores electro-thermal co-design methods for systems with limited cooling capacity. Our contributions include innovative approaches and hardware demonstrations for (i) Post-silicon thermal characterization and management, and (ii) Integration of advanced active cooling, such as, thermoelectric devices and in-package microfluidics for mobile processors.
- Advanced 2.5D/3D Packaging: Our research is focussed on designing energy-efficient system-in-package platforms with 3D and 2.5D (interposer) integration. Our interests include (i) Innovative system architecture to exploit 2.5D and 3D packaging; (ii) (iii) low-power, robust, and testable all-digital interface circuits; and (iv) power delivery/distribution and thermal management solutions.