Recent Publications in Electro-thermal Co-design

Conference Papers/Presentations

  1. W. Yueh, Z. Wan, Y. Joshi, and S. Mukhopadhyay, “Experimental Characterization of In- Package Microfluidic Cooling on a System-On-Chip,” IEEE/ACM International Symposium on Low Power Electronic Design (ISLPED), July 2015. Best Paper Award
  2. W. Song, S. Mukhopadhyay, and S. Yalamanchili, “Managing Performance-Reliability Tradeoffs in Multicore Processors,” IEEE International Reliability Physics Symposium, April 2015. Best Student Paper Award.
  3. Z. Wan, W. Yueh, Y. Joshi, and S. Mukhopadhyay, “On-Chip Temperature and Leakage Power Measurement and Comparison between Air Cooling and Microfluidic Cooling,” THERMINIC Sept. 2014
  4. B. Alexandrov, K. Z. Ahmed, and S. Mukhopadhyay, “An On-Chip Autonomous Thermoelectric Energy Management System for Energy-Efficient Active Cooling,” IEEE International Symposium on Low-power Electronic Design (ISLPED), Aug. 2014. Best Paper Award.
  5. W. Yueh, K. Z. Ahmed, and S. Mukhopadhyay, “Field Programmable Thermal Emulator (FPTE): An All-Silicon Test Structure for Thermal Characterization of Integrated Circuits,” IEEE Semi Therm March 2014. Honorable Mention in the Best Paper Award Selection.
  6. S. Parthasarathy, K. Z. Ahmed, B. Alexandrov, S. Kumar, and S. Mukhopadhyay, “Energy Efficient Active Cooling of Integrated Circuits Using Autonomous Peltier/Seebeck Mode Switching of a Thermoelectric Module,” IEEE Semi Therm, March 2014.
  7. J. Kung, M. Cho, S. Yalamanchili, and S. Mukhopadhyay, “On-line Real-time Temperature and Power Estimation of an IC using Time-domain Thermal Filters,” IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2013.
  8. M. Cho, M. Khellah, K. Chae, K. Ahmed, J. Tschanz, and S. Mukhopadhyay, “Characterization of Inverse Temperature Dependence in Logic Circuits,” IEEE Custom Integrated Circuits Conference (CICC), Sept. 2012.
  9. S. Chatterjee, M. Cho, R. Rao, and S. Mukhopadhyay, “Impact of Die-to-Die Thermal Coupling on the Electrical Characteristics of 3D Stacked SRAM Cache,” IEEE Semi-Therm, Feb. 2012.
  10. M. Cho, W. Song, S. Yalamanchili, and S. Mukhopadhyay, “Thermal System Identification (TSI): A Methodology for Post-silicon Characterization and Prediction of the Transient Thermal Field in Multicore Chips,” IEEE Semi-Therm, Feb. 2012.
  11. B. Alexandrov, O. Sullivan, S. Kumar, and S. Mukhopadhyay, “Prospects of Active Cooling with Integrated Super-Lattice based Thin-Film Thermoelectric Devices for Mitigating Hotspot Challenges in Microprocessors,” IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC), Jan. 2012.
  12. S. Chatterjee, S. Salahuddin, S. Kumar, and S. Mukhopadhyay, “Analysis of Thermal Behaviors of Spin-Torque-Transfer RAM: A Simulation Study,” International Symposium on Low-Power Electronic Design (ISLPED), August 2010, pp. 13-18.

Journal Articles

  1. W. Yueh, Z. Wan, H. Xiao, S. Yalamanchili, Y. Joshi and S. Mukhopadhyay, “Active Fluidic Cooling on Energy Constrained System-on-Chip Systems,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 11, pp. 1813-1822, Nov. 2017.
  2. W. Yueh, Z. Wan, Y. Joshi, and S. Mukhopadhyay, “Design, Characterization, and Application of a Field Programmable Thermal Emulation Platform”, IEEE Transactions on Component, Packaging, and Manufacturing Technology (TCPMT), vol. 6, no. 9, Sept. 2016, pp. 1330-1339.
  3. H. Xiao, W. Yueh, S. Mukhopadhyay and S. Yalamanchili, “Thermally Adaptive Cache Access Mechanisms for 3D Many-core Architectures”, IEEE Computer Architecture Letters, vol. 15, no. 2, July-Dec. 1 2016, pp. 129-132.
  4. W. Song, S. Mukhopadhyay, and S. Yalamanchili, “Architectural Reliability: Lifetime Reliability Characterization and Management of Many-Core Processors,” IEEE Computer Architecture Letters (CAL), Vol. 14, No. 2, Dec. 2015, pp. 103-106.
  5. W. Song, S. Mukhopadhyay, and S. Yalamanchili, “KitFox: Multi-Physics Libraries for Integrated Power, Thermal, and Reliability Simulations of Multicore Microarchitecture,” IEEE Transactions on Component, Packaging and Manufacturing Technology, Vol.5, No.11, Nov. 2015, pp.1590-1601.
  6. J. Kung, W. Yueh, S. Yalamanchili, and S. Mukhopadhyay, “Post-silicon Estimation of Spatiotemporal Temperature Variations Using MIMO Thermal Filters,” IEEE Transactions on Component, Packaging, and Manufacturing Technology (TCPMT), vol.5, no.5, May 2015, pp.650 – 660.
  7. B. Alexandrov, O. Sullivan, W. Song, S. Yalamanchili, S. Kumar, and S. Mukhopadhyay, “Control Principles and On-chip Circuits for Active Cooling using Integrated Super Lattice Based Thin-Film Thermoelectric Devices,” IEEE Transactions on VLSI Systems (TVLSI), vol. 22, no. 9, September 2014, pp. 1909-1919.
  8. M. Cho, K. Z. Ahmed, W. Song, S. Yalamanchili, and S. Mukhopadhyay, “Post-Silicon Characterization and On-Line Prediction of Transient Thermal Field in Integrated Circuits Using Thermal System Identification,” IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT), vol.4, no.1, Jan. 2014, pp.37-45.
  9. O. Sullivan, B. Alexandrov, S. Mukhopadhyay, and S. Kumar, “3D Compact Model of Packaged Thermoelectric Coolers,” ASME Journal of Electronic Packaging (JEP), vol. 135, no. 3, June 2013, pp. 031006-031006-7.
  10. W. Yueh, S. Chatterjee, A. Trivedi, and S. Mukhopadhyay, “Performance and Robustness of 3D Integrated SRAM Considering Tier-to-tier Thermal and Supply Cross-talk,” IEEE Transactions on Components, Packaging, and Manufacturing Technologies (TCPMT), vol. 3, no.6, June 2013, pp. 943-953.
  11. M. Redmond, K. Manickaraj, O. Sullivan, S. Mukhopadhyay, and S. Kumar, “Hotspot Cooling in Stacked Chips using Thermoelectric Coolers,” IEEE Transactions on Components, Packaging, and Manufacturing Technologies (TCPMT), vol.3, no.5, May 2013, pp.759-767.
  12. M. Cho, C. Kersey, M. P. Gupta, N. Sathe, S. Kumar, S. Yalamanchili, and S. Mukhopadhyay, “Power Multiplexing for Thermal Field Management in Many Core Processors,” IEEE Transactions on Components, Packaging, and Manufacturing Technologies (TCPMT), vol. 3, no. 1, January 2013, pp. 94-104. Received IEEE TCPMT Best Paper Award, 2013.
  13. M. P. Gupta, M. Cho, S. Mukhopadhyay, and S. Kumar, “Thermal Investigation into Power Multiplexing for Homogeneous Many-Core Processors,” ASME Journal of Heat Transfer, vol. 134, No. 6, June 2012, 061401-061401-8.
  14. S. Chatterjee, S. Salahuddin, S. Kumar, and S. Mukhopadhyay, “Impact of Self-Heating on Reliability of Spin-Torque-Transfer RAM Cell,” IEEE Transactions on Electron Devices (TED), Vol. 59, No. 3, March 2012, pp. 791-799.